Provedení- Improved chip removal results in a longer service life and a high removal rate
- Particularly when grinding aluminium and non-ferrous metals
- The open-structured ceramic abrasive grain with self-sharpening effect also offers aggressive grinding
Výhoda- Self-sharpening effect results in a very high removal rate thanks to constant regeneration of sharp grain tips
- The additional STEARATE Plus layer significantly reduces chip adhesion and thus clogging of the abrasive
- Reduced chip adhesion increases service life, resulting in fewer tool changes and increased productivity
- Dimensionally stable vulcanised fibre carrier
PoznámkyWir empfehlen den Einsatz von Winkelschleifern ab 1.400 Watt, um eine effiziente Bearbeitung von härteren Materialien und anspruchsvolleren Anwendungen zu gewährleisten.